ADPA7007-EVALZ

ADPA7007-EVALZ is an evaluation board to evaluate the ADPA7007 20GHz to 44GHz, GaAs, pHEMT, 31.5dBm (<gt/>1W), MMIC power amplifier. The ADPA7007-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminium heat sink. The ADPA7007-EVALZ uses the same PCB as the ADPA7005-EVALZ but with the ADPA7007 populated on the board. The heat sink assists in providing thermal relief to the ADPA7007 as well as mechanical support to the PCB. Mounting holes on the heat sink allow it to be attached to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9mm female coaxial connectors and their respective RF traces are of 50 Ω characteristic impedance. The board is populated with components suitable for use over the entire operating temperature range of the device.

• 2-layer Rogers 4350B evaluation board with heat sink
• End launch 2.9mm RF connectors
• Through calibration path

메모

ADI products are only authorized (and sold) for use by the customer and are not to be resold or otherwise passed on to any third party