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수량 | 가격 |
---|---|
1+ | ₩4,214 |
10+ | ₩3,729 |
25+ | ₩3,728 |
50+ | ₩3,727 |
100+ | ₩3,671 |
제품 정보
제품 개요
MT29F2G08ABAEAH4 is a NAND flash memory include an asynchronous data interface for high-performance I/O operations. This device use a highly multiplexed 8-bit bus (I/Ox) to transfer commands, address and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection and monitor device status (R/B#). This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densities with no board redesign. A target is the unit of memory accessed by a chip enable signal. A target contains one or more NAND Flash die. A NAND Flash die is the minimum unit that can independent execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). There is at least one NAND Flash die per chip enable signal.
- Single-level cell (SLC) technology, asynchronous I/O performance, array performance
- Erase block is 700µs (typical), command set is ONFI NAND flash protocol
- Advanced command set, one-time programmable (OTP) mode
- Interleaved die (LUN) operations, read unique ID, internal data move
- Operation status byte provides software method for detecting
- Pass/fail condition, write-protect status, RESET (FFh) required as first command after power-on
- Alternate method of device initialization (Nand-Init) after power up (contact factory)
- 2Gb density, 8bit device width, SLC level
- 3.3V (2.7–3.6V) operating voltage, asynchronous interface
- 63-ball VFBGA (9 x 11 x 1.0mm) package, commercial operating temperature range from 0°C to 70°C
기술 사양
SLC NAND
256M x 8bit
VFBGA
50MHz
2.7V
3.3V
0°C
3.3V Parallel NAND Flash Memories
2Gbit
Parallel
63Pins
16ns
3.6V
Surface Mount
70°C
기술 문서 (1)
법률 및 환경
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최종후의 중요 제조 공정이 이루어진 국가
RoHS
RoHS
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