24,000 지금 제품을 예약하실 수 있습니다
수량 | 가격 |
---|---|
1+ | ₩229 |
10+ | ₩194 |
25+ | ₩182 |
50+ | ₩174 |
100+ | ₩166 |
250+ | ₩156 |
500+ | ₩147 |
1000+ | ₩140 |
2500+ | ₩132 |
제품 정보
제품 개요
The Micro-Fit 3.0 series Connector is a 3mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 8.5A to meet low- to mid-range power application needs. Molex's Micro-Fit 3.0 interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. These can be purchased in pure tin or one of two thicknesses of select gold. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects.
- Fully isolated contacts
- Full polarization
- Positive locks
- UL94V-0 Flammability
애플리케이션
Aerospace, Defence, Military, Consumer Electronics, Security, Communications & Networking, Computers & Computer Peripherals, Medical, Power Management, Industrial
기술 사양
Micro-Fit 3.0 RMF 46235
Crimp
Gold Plated Contacts
24AWG
No SVHC (21-Jan-2025)
Socket
20AWG
Molex Micro-Fit 3.0 43025, 43645 & Micro-Fit BMI 44133 Series Receptacle Housing Connectors
Copper Alloy
관련 제품
2개 제품을 찾았습니다.
법률 및 환경
최종후의 중요 제조 공정이 이루어진 국가원산지:United States
최종후의 중요 제조 공정이 이루어진 국가
RoHS
RoHS
제품 준수 증명서