GAP PAD TGP 800VO

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This is a highly conformable gel-like modulus.

• Eliminates air gaps to reduce thermal resistance
• Highly conformable to reduce interfacial resisitance
• Low-stress vibration dampening
• Compatible with automated dispensing equipment
• Supplied in a 100 x 100mm sheet