A16000-01

The TPCM 580SP is a Thermal Phase Change Material (PCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. It is inherently tacky, flexible and exceptionally easy-to-use. At temperatures above its transition temperature of 50°C (122°F), it begins to soften and flow, filling the microscopic irregularities of the components it comes into contact with. The result is an interface with minimal thermal contact resistance. Due to the gradual change in viscosity (softening), it minimizes migration (pump-out). The PCM can be supplied as cut parts in strips and rolls with top tabbed liners for easy application. It is suitable for use with microprocessors, chipsets, graphic processing chips and custom ASICS applications.

• High-performance PCM
• Low total thermal resistance
• Inherently tacky and easy-to-use no adhesive required
• High reliability
• Non-reinforced film construction and composition
• -40 to 125°C Operating temperature

애플리케이션

Thermal Management