더 필요하세요?
수량 | 가격 |
---|---|
1+ | ₩33,963 |
5+ | ₩32,013 |
10+ | ₩30,062 |
20+ | ₩28,830 |
50+ | ₩27,597 |
제품 정보
제품 개요
The A15993-00 is a 0.5mm Thermal Gap Filler with excellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex™ HR600's recovery properties for applications requiring material rework result in continued mechanical integrity even after device rework and re-assembly. It is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and component transport. It is suitable for cooling components to chassis, frame or other mating components, memory modules, home and small office network equipment, mass storage devices, radios, LCD/PDP flat panel TV, set top boxes, IT infrastructure applications.
- Mid-performance gap filler
- Electrically insulating
- Soft and compliant
- Naturally tacky for adhesion during assembly and transport
- UL94V-0 Flammability rating
- -45 to 200°C Operating temperature
애플리케이션
Thermal Management, Audio, Automotive, Communications & Networking, LED Lighting
기술 사양
3W/m.K
0.5mm
-
229mm
No SVHC (07-Nov-2024)
Silicone Elastomer
-
229mm
Tflex HR600
기술 문서 (1)
법률 및 환경
최종후의 중요 제조 공정이 이루어진 국가원산지:China
최종후의 중요 제조 공정이 이루어진 국가
RoHS
RoHS
제품 준수 증명서