83709

The 83709 is a most advanced Pressure Sensor based on already known technology, the device adds a level of integration by including microcontroller and LF-input stages to meet market demands for flexible, customer specific behaviour and solutions. The sensor is a micro system consisting of a micro machined sensor die and flexible ASIC. The device has excellent media compatibility due to a patented bulk micro machined triple stack sensor die design, utilizing buried piezoresistive elements and backside media access to pressure diaphragm. With this design the internal connectors and piezoresistive elements of the pressure bridge are isolated from the measurement media. The isolation is of great advantage in terms of sensor stability and reliability over a very long lifetime. The pressure sensor design has been proven in harsh environment applications during a period of more than 10years.

• RISC microcontroller
• High flexibility
• Code protection
• ROM library functions
• 5 General purpose I/O pins
• On-chip RC oscillator
• Absolute pressure sensor
• On-chip accelerometer option
• Calibrated and compensated
• Temperature and supply
• Voltage measurements output
• Sensor self diagnosis
• Unique electronic sensor ID
• 2-channel LF receiver for wireless applications (125kHz)
• High reliability and accuracy over lifetime
• High media compatibility
• 0.3µA Low standby current
• High static acceleration and shock capability (2000g)

애플리케이션

Sensing & Instrumentation, Industrial