제품 정보
573400D00000G의 대체 제품
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제품 개요
The 573400D00000G is a surface-mount Heat Sink with tin-plated finish for use with D3 Pak (TO-268) package semiconductors. Its unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through-hole solutions. The semiconductor's conventional copper drain pad is modified to extend beyond the edges of the semiconductor package providing space to mount the heat sink. The device and heat sink are soldered directly to the modified drain pad creating a thermal transfer path from the package tab to the surface mount heat sink. The elevated "Wings" of the heat sink provide ample surface area to dissipate the heat into the surrounding environment.
- Horizontal mount orientation
- No attachment holes required in the printed circuit board
- Wing configuration will not interfere with adjacent components
- Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders
애플리케이션
HVAC, Thermal Management, Consumer Electronics, Communications & Networking, Motor Drive & Control, Automation & Process Control, Industrial, Medical
기술 사양
14°C/W
12.7mm
31mm
Copper
0.39"
-
No SVHC (15-Jan-2018)
TO-268
10mm
-
0.5"
1.22"
TUK SGACK902S Keystone Coupler
기술 문서 (1)
법률 및 환경
최종후의 중요 제조 공정이 이루어진 국가원산지:China
최종후의 중요 제조 공정이 이루어진 국가
RoHS
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