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수량 | 가격 |
---|---|
1+ | ₩102,311 |
5+ | ₩93,964 |
10+ | ₩86,638 |
제품 정보
제품 개요
The BP100-0.008-00-1212 is a 0.008-inch Thermal Insulator used in bond-ply products requires the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a 6-month shelf life at a maximum continuous storage temperature of 35°C or 3-month shelf life at a maximum continuous storage temperature of 45°C, for maintenance of controlled adhesion to the liner. The shelf life of the bond-ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60°C. It is suitable for mount heat sink onto BGA graphic processor or drives processor and mounts heat spreader onto power converter PCB or onto motor control PCB applications.
- Fibre-glass reinforced pressure sensitive adhesive tape
- High bond strength to a variety of surfaces
- Double-sided
- High performance, thermally conductive acrylic adhesive
- Can be used instead of heat-cure adhesive, screw mounting or clip mounting
애플리케이션
Thermal Management
기술 사양
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6kV
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-
No SVHC (07-Nov-2024)
0.8W/m.K
0.203mm
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-
법률 및 환경
최종후의 중요 제조 공정이 이루어진 국가원산지:United States
최종후의 중요 제조 공정이 이루어진 국가
RoHS
제품 준수 증명서