제품 정보
제품 개요
Molex's SpeedEdge Edge-Card connector system is rugged enough to mate safely with large PCBs in high-cycle applications while providing a high-density, low-profile solution with data rates to over 40 Gbps per differential pair. They are mechanically robust with thicker walls and higher stack height when compared to other mezzanine systems and securely hold thick PCBs; delivers durability and high-mating cycles. The Split-pad PCB design allows for electrical tuning performance to reach data rates to over 40 Gbps per differential pair.
- Voltage (max) is 250VAC
- Current (max) is 1.0A per pin
- Contact resistance is 20mohm
- Dielectric withstanding voltage is 300VAC
- Insulation resistance is 10Mohm
애플리케이션
Communications & Networking, Consumer Electronics, Aerospace, Defence, Military, Medical
기술 사양
Dual Side
1.57mm
82 Contacts
82Contacts
Surface Mount
Copper Alloy
30µ" Gold Plated Contacts
SpeedEdge 173300 Series
Receptacle
0.8mm
2Rows
Straight
Solder
Gold Plated Contacts
LCP (Liquid Crystal Polymer) Body
No SVHC (21-Jan-2025)
법률 및 환경
최종후의 중요 제조 공정이 이루어진 국가원산지:China
최종후의 중요 제조 공정이 이루어진 국가
RoHS
RoHS
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