제품 정보
제품 개요
LBEE5XV2EA-802 is a Type 2EA small and very high-performance module based on Infineon CYW55573 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac/ax 2×2 MIMO Bluetooth® 5.3 BR/EDR/LE up to 1.2Gbps PHY data rate on Wi-Fi® and 3Mbps PHY data rate on Legacy Bluetooth (EDR), and 2Mbps PHY data rate on Bluetooth® LE. The WLAN section supports PCIe v3.0 Gen 2 and SDIO 3.0 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data. The CYW55573 implements highly sophisticated enhanced collaborative coexistence H/W mechanisms and algorithms, which ensure that WLAN and Bluetooth® collaboration is optimized for maximum performance. In IEEE 802.11ax mode, WLAN operation supports rates of MCS0–MCS11 (up to 1024 QAM) in 20MHz, 40MHz and 80MHz channels for data rate up to 1.2Gbps. The small form factor facilitates integration into size and power sensitive applications such as IoT applications, handheld wireless system, gateway and more.
- Good for industrial applications with operating temperature up to +85°C
- 2.4GHz, 5GHz & 6GHz Wi-Fi® + Bluetooth® module
- FCC/IC "Reference" certified
기술 사양
6GHz
Wireless Connectivity
기술 문서 (1)
법률 및 환경
최종후의 중요 제조 공정이 이루어진 국가원산지:Switzerland
최종후의 중요 제조 공정이 이루어진 국가
RoHS
RoHS
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