NX-DP-GAN039-TSC

NX-DP-GAN039-TSC is a double pulse evaluation board with top-side cooled CCPAK GaN FETs. It enables double-pulse testing of GaN FETs in a top-side cooled copper-clip package (CCPAK). It is optimized for low inductance and features on-board current sensing capability to support typical switching performance evaluation, such as switching losses Esw, voltage- and current slopes, reverse-recovery Qr or gate drive performance directly out of the box. The evaluation board can be configured to support both thermal resistance analysis as well as continuous half-bridge converter operation in buck- or boost mode.

• Input and output voltage 450V DC max
• Ambient temperature <50°C
• Auxiliary supply : 12V DC nominal, 0.5A
• Logic inputs: recommended 0V low, 3.3V high (5V tolerant), 50 ohm terminated SMA